IEEE EPS – Electronics Packaging Society

IEEE EPS – Electronics Packaging Society

Activities
Publications
Important Links
Contact

Activities
Publications
Important Links
Contact

Contact

EPS German Chapter
c/o Fraunhofer IZM
Gustav-Meyer-Allee 25
D-13355 Berlin

Georg Weigelt
Phone: +49(0) 30/ 464 03-279
georg.weigelt(at)izm.fraunhofer.de

News

ESTC 2022

The Electronics System-Integration Technology Conference (ESTC) is the premier international event in the field of electronics packaging and system integration. The conference is organized every two years in Europe and is supported by IEEE-EPS in association with IMAPS-Europe.

PCIM Europe

Fraunhofer IZM will be presenting technological highlights at PCIM 2022 (Power Conversion Intelligent Motion) in Nuremberg from May 10-12, 2022. This time, the world's leading trade fair on the topics of power electronics, intelligent drive technology, renewable energies as well as energy management will be taking place both onsite and online.

Imprint
Privacy Policy
Liability for Contents

©2022/EPS – Electronics Packaging Society German chapter