ESTC 2024

Berlin | September 11 – 13, 2024

The 10th IEEE Electronics System-Integration Technology Conference (IEEE ESTC 2024) was a major success, marking a significant milestone in the field of advanced packaging and system integration.

The three-day event, held in Berlin, Germany, attracted 430 delegates from 27 countries, bringing together professionals with diverse expertise in technology development and industrial management. Attendees contributed to the event with four keynote speeches, 117 oral presentations, and 46 posters, sharing their extensive knowledge and insights during sessions and networking opportunities.

Program Highlights:

  • Three Professional Development Courses (PDCs) held prior to the conference
  • The IEEE EPS Heterogeneous Integration Roadmap Workshop
  • Five Special Sessions covering topics such as IPCEI ME/CT, Education, Photonic Packaging, and Quantum Technologies
  • Panel Discussion on “Chiplets for Automotive”

A memorable highlight of the conference was the dinner at the iconic Wasserwerk, where attendees enjoyed fine dining amidst the breathtaking views of the illuminated historical water pump station—a perfect setting for informal discussions and networking.

Special congratulations go to the winners of this year’s Best Paper Award, Charles Bon-Mardion and his team, for their outstanding work on “Superconducting Superlattice Interconnects for Cryogenic Systems.” Additionally, Nyake Gahein-Sama and his team received the Best Poster Award for their research on “Alignment Between Subsequent 3D Molding Layers for Optimized Performance of 3D Integrated Patch Antennas for Advanced Sensing Applications.” The awards were presented by Program Chair Toni Mattila and Poster Chair Karl-Friedrich Becker, respectively. More information on the award winners can be found here.

The organizers extend their heartfelt thanks to the keynote speakers, presenters, session chairs, exhibitors, and sponsors who made this event possible. We look forward to welcoming you all at IEEE ESTC 2026 in Helsinki!

ESTC 2022

Fraunhofer IZM at the ESTC 2022

Sibiu, Romania / September 13, 2022 – September 16, 2022

The Electronics System-Integration Technology Conference (ESTC) is the premier international event in the field of electronics packaging and system integration. The conference is organized every two years in Europe and is supported by IEEE-EPS in association with IMAPS-Europe. The 9th ESTC will be taking place in Sibiu, Romania. Placed in the middle of Romania, surrounded by the the high Carpathian Mountains and Cibin river, Sibiu is a citadel of the European electronics industry and represents a place where culture, landscape, gastronomy and profession merge in a friendly pleasant environment.

The ESTC 2022 seeks original, noncommercial papers describing research and innovations in all areas of electronics packaging and system integration. Authors are invited to submit an abstract describing recent work. Abstracts must detail the objectives of the work presented and demonstrate new results.

Proposed Topics:

  • Advanced packaging
  • Materials for interconnects and packaging
  • Optoelectronic systems packaging
  • Assembly and manufacturing technologies
  • Design tools and modeling
  • Power electronics system packaging
  • Advanced technologies for emerging systems
  • Reliability and quality of electronic devices and systems
  • Flexible, printed and hybrid electronics
  • RF, mm-wave and THz systems packaging
  • Global education for electronics

The technical program will include oral talks, poster presentations, an exhibition, special sessions and invited keynote talks given by renowned speakers.

More information: https://www.izm.fraunhofer.de/en/news_events/events/estc.html
Event website: https://www.estc-conference.net/estc-2022

PCIM Europe

Fraunhofer IZM presents power highlights at PCIM Europe 2022

In 2022 Fraunhofer IZM will again be presenting at PCIM (Power Conversion Intelligent Motion) Europe.

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Advanced Packaging: Simulation, Technology and Reliability

Expert Sessions

Fraunhofer IZM specializes in applied and industrial contract research. With technology clusters in the field of wafer and substrate process technology as well as a high level of competence in simulation and measurement technology, the entire spectrum required for the implementation of reliable electronics and their integration into the application is covered.

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